Qualcomm has already formalized its flagship chipset for 2021, we’re talking about the Snapdragon 888. However, we still haven’t seen a successor to its high-end mid-range line in the 7-series, and the Snapdragon 765 is getting a bit old.
Apparently, it won’t be long now, as the company is said to have introduced the new SoC at some point before the end of this month. We’re assuming it’ll be called the Snapdragon 775, though, who knows – maybe it’ll end up being the 788?
Anyway, some details about it were leaked today, and these are from an internal presentation. Other sources claim the data is accurate, but old, so some things may have changed.
However, the most important detail is omitted. We are talking about the layout of the processor core and clocks. All we know is that it will be Kryo 6xx cores, but that could mean anything. What has been mentioned in the slides is that this will be manufactured on a 5nm process like the 888, and will support 3200 MHz LPDDR5 and 2400 MHz LPDDR4X RAM, as well as UFS 3.1 Two-Lane HS Gear 4.
Moving on, the Spectra 570 ISP supports 4K60 video recording and three 28MP sensors running at the same time, as well as 64 + 20MP at 30fps. In terms of connectivity, we are looking at Wi-Fi 6E with 2×2 MIMO, Bluetooth 5.2 (codename Milan), LTE Cat.18, Dual 5G, mmWave 5G, SA and NSA support, VoNR and NR CA, supporting Load 4×4 MIMO on the downlink and 2×2 MIMO on the uplink for Sub-6 5G. The Sub-6 will work with FDD at 3 GHz and TDD in the n77, n78 and n79 bands. The Snapdragon 775 will also have the WCD9380 / WCD9385 audio chip.
According to some previously leaked AnTuTu scores, the 775 should perform much better than its predecessor, and all of those specs are pretty big upgrades.
Source | Via
