GRENOBLE, FRANCE – Media OutReach – October 12, 2023 – Teledyne e2v develops, in collaboration with
Microchip Technology, a revolutionary spatial computing reference design to enable high-speed data routing in space applications. This innovative reference design will be presented at EDHPC 2023 (European Data Handling & Data Processing Conference, October 2-6, 2023, Juan-Les-Pins, France).
Featuring Teledyne e2v’s radiation-tolerant Qormino®
QLS1046-Space processing platform, alongside Microchip’s data communications technology, the spatial computing reference design is fully radiation tolerant (RT). It offers a combination of robust, high-performance processing and enhanced subsystem connectivity capabilities. Thanks to the computing capacity of 30,000 DMIPS offered by the four Arm® Cortex®-A72 cores and 4 to 8 GB of high speed
DDR4 of QLS1046-Space and its multiple high-speed interfaces, the architecture can process and route large incoming data rates from a variety of sources, including telecom RF front-ends, high-resolution image sensors, radars and other processing devices in the spacecraft.
High-speed connectivity is provided using Gigabit Ethernet interfaces, supported by Microchip RT Ethernet PHYs. The reference design for spatial computing uses the
VSC8541RT PHY to propose two RGMII links, as well as the new
VSC8574RT to offer two SGMII interfaces, leading to a total of four Gigabit Ethernet connections. This number could even be increased to seven Ethernet interfaces by exploiting all the high-speed interfaces available on the QLS1046-Space, and up to 18 with the future LX2160-Space.
This allows high-speed transfers between the QSL1046-Space and other devices placed on different companion boards within the satellite or spacecraft. Target use cases for this space computing reference design include, among others, Earth observation, SATCOM applications, space defense, and space debris monitoring.
“In the vast majority of cases, modern space hardware will have a decentralized architecture. Normally, communication between constituent subsystems relies on data transfer rates of 10 to 100 Mbits. Higher levels of functional sophistication are now incorporated for purposes such as advanced telecommunications schemes, real-time image processing, AI-based analysis and navigation. This means that increased performance is mandatory,” explains Thomas Porchez, applications engineer at Teledyne e2v. “By working with Microchip, we were able to significantly increase the interfacing capabilities of designs using the QLS1046-Space, leading to accelerated speeds and extended propagation range. Therefore, they are completely aligned with what Space customers now demand in edge computing. applications.”
“The integration of the Microchip family of radiation-tolerant Gigabit Ethernet PHYs into the Teledyne e2v space computing reference design will provide space customers with high reliability and high-speed connectivity in a variety of space applications,” he said. said Nicolas Ganry, senior director of marketing and applications for Microchip’s aerospace division. and defense business unit. “For more than 60 years, Microchip has remained committed to carrying out space missions.”
Teledyne e2v and Microchip staff will present papers relating to their involvement in localized processing and cross-board communication for space deployments at the EDHPC conference.
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