Fully upgraded servers with new Intel® Xeon® 6900 series processors with P cores optimized for maximum performance now ship in volume, with support for next-generation GPUs, higher bandwidth memory, 400 GbE networking, E1.S and E3.S drives and industry‘s Direct-on-chip liquid cooling solutions
SAN JOSE, California., January 9, 2025 /PRNewswire/ — Supermicro, Inc. (NASDAQ: SMCI), a provider of total computing solutions for AI/ML, HPC, Cloud, Storage and 5G/Edge, begins shipments of peak performance servers powered by Intel Xeon 6900 series processors with cores P. The new systems feature a range of new and enhanced technologies with new architectures optimized for the most demanding high-performance workloads, including AI at scale, HPC at scale cluster and environments where a maximum number of GPUs is required, such as collaborative design and media delivery.
“The systems now shipping in volume promise to unlock new capabilities and new levels of performance for our customers around the world, with low latency, maximum I/O expansion delivering high throughput with 256 performance cores per system , 12 memory channels per CPU with MRDIMM support. and high-performance EDSFF storage options,” said Charles LiangPresident and CEO of Supermicro. “We are able to deliver our full range of servers with these new application-optimized technologies through our server building block solutions.® design methodology. With our global ability to ship solutions at any scale and our in-house developed liquid cooling solutions delivering unmatched cooling efficiency, Supermicro is leading the industry into a new era of peak performance computing.
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There are currently several X14 systems available to customers for remote testing and validation via Supermicro. JumpStart Program.
Supermicro X14 systems are available in a variety of form factors, each optimized for a range of performance-demanding workloads:
- GPU-optimized supporting the latest generation of SXM and PCIe GPUs, with improved thermal capabilities and direct-on-chip liquid cooling on select models.
- High-density multi-nodes, including the all-new FlexTwin™ and GrandTwin® models as well as the proven and award-winning SuperBlade® architecture.
These models leverage shared components to increase efficiency and can be equipped with liquid cooling directly on the chip for maximum performance density.
- Supermicro Hyper’s market-proven rackmounts combine single or dual-socket architectures with flexible I/O and storage configurations in traditional rackmount form factors to help businesses and data centers evolve as their workloads evolve.
Supermicro’s peak performance X14 systems support Intel Xeon 6900 series processors with P-cores, which feature up to 128 performance cores per processor, support for high bandwidth MRDIMMs up to 8800 MT/ s and integrated accelerators, notably those specific to AI. IntelAMX.
X14 systems represent the perfect building blocks for data centers of any scale, with Supermicro able to provide complete rack-level integration services, including design, construction, testing, validation and delivery. Industry-leading global manufacturing capacity of up to 5,000 racks per month (2,000 liquid-cooled) and extensive test and burn-in facilities enable Supermicro to deliver solutions at any scale in weeks, and no, in a few months. With Supermicro’s complete in-house liquid-cooled direct-on-chip cold plate solutions, liquid cooling can be easily included in rack-level integrations to further increase system efficiency, reduce instances of thermal throttling, and reduce cost. both the TCO and the total cost of environment (TCE) of data center deployments. These turnkey solutions include rack, cabling, power and cooling infrastructure to simplify the deployment of large-scale solutions.
To maximize the performance and density potential of the latest X14 systems, Supermicro also offers comprehensive liquid cooling solutions developed in-house, including cold plates for CPUs, GPUs, memory, cooling distribution units, cooling distribution headers, pipes, connectors and cooling towers. Liquid cooling is easily included in rack-level integrations to increase system efficiency, reduce instances of thermal throttling, and reduce both TCO and total environmental cost (TCE) of data center deployments. data.
Peak-performance X14 Supermicro systems featuring Intel Xeon 6900 series processors with P-cores include:
Optimized for GPU – The highest-performing Supermicro . These systems are available in air- or liquid-cooled configurations.
PCIe GPU – Designed for maximum GPU flexibility, supporting up to 10 double-wide PCIe 5.0 accelerator cards in a thermally optimized 5U chassis or an edge-optimized 3U chassis. These servers are ideal for AI inference, media, collaborative design, simulation, cloud gaming, and virtualization workloads.
Intel® Gaudí® 3 AI accelerators – Supermicro now offers the industry’s first AI server based on the Intel Gaudi 3 accelerator hosted by Intel Xeon 6 processors. Designed to increase efficiency and reduce the cost of training AI models at scale and of AI inference, the system includes eight Intel Gaudi 3 accelerators on a universal OAM baseboard, six integrated OSFP ports for cost-effective scalable networking and open networking. platform designed to use a community-based open source software stack, requiring no software licensing costs.
SuperBlade® – Supermicro’s high-performance, density-optimized, energy-efficient 6U SuperBlade X14 maximizes rack density, with up to 100 servers and 200 GPUs per rack. Optimized for AI, HPC, and other compute-intensive workloads, each node features direct-on-chip air cooling or liquid cooling to maximize efficiency and achieve the lowest PUE with best-in-class TCO, plus connectivity for up to four integrated Ethernet switches with 100G uplinks and front-end I/O supporting a range of flexible networking options up to 400G InfiniBand or 400G Ethernet per node.
FlexTwin™ – The new Supermicro Optimized for HPC and other compute-intensive workloads, each node features direct-on-chip liquid cooling only to maximize efficiency and reduce instances of CPU thermal throttling, as well as I/O. S forward and reverse low latency HPC supporting a range of flexible networks. options up to 400G per node.
Hyper – X14 Hyper is Supermicro’s flagship rackmount platform designed to deliver the highest performance for demanding AI, HPC and enterprise applications, with single or dual socket configurations supporting GPUs Double-width PCIe for maximum workload acceleration. Direct-on-chip air cooling and liquid cooling models are available to help support high-end processors without thermal limitations and reduce data center cooling costs while increasing efficiency.
About Super Micro Computer, Inc.
Supermicro (NASDAQ: SMCI) is a global leader in application-optimized total IT solutions. Founded and operating in San Jose, CaliforniaSupermicro is committed to delivering first-to-market innovation for enterprise IT, cloud, AI and telecom/Edge 5G infrastructure. We are a total IT solutions provider with server, AI, storage, IoT, switching, software and support services. Supermicro’s expertise in motherboard, power supply and chassis design further enables our development and production, enabling next-generation innovation, from the cloud to the edge, for our global customers. Our products are designed and manufactured in-house (in the United States, AsiaAnd the Netherlands), leveraging global operations for greater scale and efficiency and optimized to improve TCO and reduce environmental impact (Green Computing). The award-winning Server Building Block Solutions® portfolio allows customers to optimize their workload and exact applications by choosing from a broad family of systems built from our flexible, reusable building blocks that support a comprehensive set of form factors, processors, memory, GPU solutions, storage, networking, power and cooling (air conditioning, free air cooling or liquid cooling).
Supermicro, Server Building Block Solutions and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc.
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