New contributions to OCP include Foundation Chiplet System Architecture (FCSA) and BoW 2.0 for memory-intensive AI and HPC workloads.
SAN JOSE, California., October 15, 2025 /PRNewswire/ — Open Compute Project Foundation (OCP), the international nonprofit organization that brings large-scale innovation and best practices to everyone, today announced major contributions that expand the OCP open chiplet economy and strengthen industrial collaboration around chiplet-based design.
- An Arm-led workflow contributing to the Foundation Chiplet System Architecture (FCSA), a vendor-neutral specification derived from the Arm Chiplet System Architecture (CSA). FCA establishes a common basis for partitioning monolithic systems into interoperable chipsets, enabling use on any processor architecture, including memory, I/O, and accelerators.
- A project led by Eliyan contribution to memory interconnection improve the OCP BoW 2.0 Chipset Interconnect Specification. to support advanced memory bandwidth requirements for AI, HPC, gaming and automotive workloads.
“These contributions reflect the momentum of the open chipset economy because it builds on a strong foundation of collaboration on open standards, tools and best practices,” said Cliff Grossner, Ph.D., chief innovation officer at OCP. “The Foundation Chiplet system architecture provides a neutral basis for collaboration, reducing fragmentation and giving the industry confidence in true interoperability. Meanwhile, BoW 2.0 enhancements expand Chiplet adoption to memory-intensive applications.
Foundation Chiplet System Architecture (FCSA)
The Foundation Chiplet System Architecture (FCSA) addresses the industry’s need for open, interoperable foundations to make chiplet design practical at scale. By bringing FCA to OCP and its members, Arm is enabling progress toward a vendor-neutral chipset market. The FCA provides a baseline for how System-in-Package (SiP) designers can decompose monolithic SoCs into chipsets, specifying common partitioning approaches that can extend across processor architectures. This will help the industry maximize Chiplet reuse, drive a wider choice of compatible IP blocks, enable common design and validation tools, and maximize flexibility and choice by avoiding lock-in to proprietary Chiplet standards.
“As AI drives a fundamental shift in how data centers are built, chipsets become essential to building scalable and efficient infrastructure,” said Mohamed Awad, senior vice president and general manager of the infrastructure business at Arm. “By bringing the Foundation Chiplet system architecture to OCP, we are helping lay the foundation for an open Chiplet ecosystem that unlocks innovation across the industry and accelerates the transition to AI-optimized silicon.” »
BoW 2.0 memory interconnect enhancements
With modern GPU architectures featuring directly attached memory implemented using Chiplets, the need for an open Chiplet interconnect specification has become imperative. Eliyan’s contribution extends the OCP Chip Interconnect Specification (BoW 2.0) with features designed for high-bandwidth memory applications, including support for dynamic bidirectional (half-duplex) data, enables lane provisioning as fixed unidirectional to support control and address information, increases the BoW slice width to 18 bits to accommodate two bits of data line error correction and allows additional options for clock and data alignment needed for memory applications. A target use case is to support the bandwidth of the HBM4 (2 TB/s read or write) as well as the overhead bandwidth for ECC and control signals, and install it within a range of <10 mm.
“Eliyan is proud to continue to be a key contributor to the Bunch of Wires (BoW) chipset interconnect specification, and specifically to lead this important BoW memory addendum. By keeping an eye on chipset and HBM connectivity across a wide range of applications and use cases, this specification makes it possible to more effectively use the BoW D2D interface to directly connect memory devices to ASICs in standard or advanced packaging. which constrains the performance of all types of AI systems – HPC server, automotive, gaming – and significantly improves memory bandwidth for XPUs,” said Kevin Donnelly, vice president of strategic marketing at Eliyan.
Expansion of the open chiplet economy
“We have seen significant growth in participation in the Open Chiplet Economy project, with the launch of several work streams this year. This is no surprise as Chiplets are poised to move from a large internal or primarily closed vendor-led ecosystem to an open, standardized ecosystem with progress driven by collaborations between large and small companies, which is exactly what OCP is designed to encourage,” said Anu Ramamurthy and Jawad. Nasrullah, head of the OCP Open Chiplet Economy project.
The Open Chiplet Economy continues to grow following the launch of the OCP Chiplet Marketplace in 2024, providing a catalog of Chiplets, design tools and services. With FCSA and BoW 2.0 enhancements, OCP enables open and interoperable approaches to chipset-based design, creating opportunities for companies of all sizes to innovate and collaborate.
“As AI workloads reshape system design, silicon must be flexible and interoperable to scale cost-effectively. By bringing this specification to OCP, we are laying the foundation for an open, architecture-neutral chip market where vendors can combine solutions with confidence. Daniel Nishball, research director, SemiAnalysis
About the Open Compute Project Foundation
The Open Compute Project (OCP) brings large-scale innovation and hyperscaler best practices to everyone, spanning technology areas from the data center to the edge, and the technology stack from silicon to systems, facilities, and site services. The international OCP community is made up of organizations and individuals from hyperscale cloud data center operators, communications providers, colocation providers, diverse enterprises and technology providers. With the principles of openness, impact, efficiency, scale and sustainability, OCP hires and trains thousands of engineers each year. Through numerous projects and initiatives, the OCP Foundation and Community respond to today’s market and shape the future.
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