MediaTek has unveiled its first 6nm chipsets, the Dimensity 1200 and 1100, for high-end phones. Next-gen chips for mid-rangers are also on the way, reports DigiTimes, which fits into the Dimensity 700 and 800 chipsets.
These will use a more mature TSMC node, 10nm or 12nm. The focus with the Dimensity 700 and 800 chipsets will be on energy efficiency, 5G sub-6 connectivity as well as multimedia and gaming performance.
We’ll see how this plays out as even the base Dimensity 700 is made on TSMC’s 7nm node (N7). MediaTek uses TSMC’s 1nm node for Helio G-series models, including budget offerings such as Helio G35 and G25.
Either way, MediaTek is expected to introduce the new Dimensity 700 chipsets first, at some point during the April-June quarter. The new Dimensity 800 chipsets will be presented at MWC 2021, which is currently scheduled from June 28 to July 1 (of course, those dates may change depending on how things develop in Europe).
Last year there were rumors of a Dimensity 600 due out in the third quarter. However, that never materialized and we haven’t heard from a 600 series chip since.