Shanghai ,, April 20, 2025 / Prnewswire / –
Q4 2024 financial protruding facts:
- Income was RMB 10.98 billionAn increase of 19.0% in annual sliding and an increase of 15.7% quarterly, a record quarter in the history of the company.
- The net profit attributable to the owners of the parent was RMB 0.53 billionAn increase of 7.3% in annual slip and 16.7% quarterly.
- Generated RMB 1.90 billion Cash from operations. With net investments of capex of RMB 1.49 billionThe cash flows available for the quarter were RMB 0.41 billion.
- Action profit was RMB 0.3.
Full year 2024 financial protruding facts:
- Income was RMB 35.96 billionAn increase of 21.2% in annual shift and a record in the history of the company.
- The net profit attributable to the owners of the parent was RMB 1.61 billionan increase of 9.4% in annual slip.
- Generated RMB 5.83 billion Cash from operations. With net investments of capex of RMB 4.57 billionThe available cash flows were RMB 1.26 billion.
- Action profit was RMB 0.9.
Shanghai, China,, April 20, 2025 – JCET Group (SSE: 600584), a world supplier of manufacturing and technology of integrated circuit back-end (IC), announced its financial results today for the exercise completed December 31, 2024. The report shows that JCET has made record income from RMB 35.96 billion For the full year 2024, representing an increase in annual sliding of 21.2%. Net profit attributable to the owners of the reached parent RMB 1.61 billionup 9.4% in annual shift. In the fourth quarter, the company’s revenues went to RMB 10.98 billionup 19.0% in annual shift and 15.7% of quarters – exceeding the RMB 10 billion Threshold for the first time and establishing a new quarterly record. Q4 net profit attributable to parent owners was RMB 0.53 billionReflecting an increase in a quarter in the 16.7%district. The company continues to strengthen its cash flow position, after having reached positive available cash flows for six consecutive years, from 2019 to 2024.
Overview of activities
In 2024, JCET exploited its main applications to strengthen customer loyalty and advance the marketing of innovative technologies, which causes annual record income. To speed up its transition to advanced packaging, the company has constantly increased investments in advanced packaging technologies. Despite the pressure on short -term costs, JCET remains convinced that its technological innovation and the adoption of intelligent applications will stimulate long -term growth. Operations in its manufacturing facilities were recovered regularly, the use of capacity continuing to increase. From the fourth quarter, packaging in the platelets, other advanced packaging and high -end test operations had reached full capacity, advanced packaging income representing more than 72% of total annual income.
In addition, JCET has developed complete packaging and personalized packaging solutions for high -performance IT systems (for example, IT, storage, connectivity and management management), with mass production capacities already in place. IT electronics revenues increased 38.1% in annual sliding. In the automotive electronics sector, breakthroughs in ADAS sensors and electrified training systems stimulated an increase in annual income of 20.5%, further strengthening the position of the company in the main supply chain of several leading players. The high performance of these corporate segments has not only acquired JCET’s competitiveness, but also threw a solid base for future products, technological progress and market expansion.
Technological innovation
JCET is devoted to advanced pioneering packaging technologies and to the promotion of collaborative development through the industrial channel. In 2024, R&D expenses reached RMB 1.72 billionAn increase of 19.3% in annual shift, the Company submitting 587 new patent applications – bearing its total portfolio of patents at 3,030 patents at the end of 2024.
In the field of integration of heterogeneous microsystems, the multidimensional packaging integration platform of JCET, XDFOI®has reached stable mass production. Likewise, the plastic encapsulated power modules for the new energy sector have entered mass production, successfully relating to challenges such as heat dissipation and warpage in high power modules, thus considerably improving product performance. With continuous progress in traditional packaging technologies, innovations such as heat dissipation of the double HFBP continued to strengthen the differentiated competitive benefits of JCET, to stimulate customer fidelity and product margins among global renown customers. In addition, by taking advantage of its pilot production chain for the packaging of car fleas, JCET has successfully developed and implemented several innovative process solutions. These initiatives have considerably improved the efficiency of production and product quality.
Major projects
In 2024, JCET continued to increase capital spending to further refine its industrial footprint in advanced technologies. Acquisition of an 80% participation in Sandisk (Shanghai) was finalized and consolidated in the financial statements from the fourth quarter. The high -end manufacturing base JCET microelectronics Microsystem Integration of high -end integration in Jiangyin has been commissioned, providing main turnkey manufacturing services for high performance fleas to global customers. Meanwhile, the Back-End Automobile Back-End Base in Shanghai The structural rise has completed and should start operations in the second half of 2025, supporting the company’s expansion more on the high -end automotive electronic market.
M. Li zhengCEO OF JCET, SAID, “by Focusing on Core Applications and Key Markets, We have anaclerated the Transformation of Our Business Structure Toward High Value-Added Segments, Achieving meaning milestones in 2024. In Light of Ongoing Structural Shifts and Emerging Trends in the Global Semiconductor Market, JCET Will Continues to Strengthen Technological Innovation and Actively Promote Open, Collaborative Commitment Across the Industry Chain, Opening A New Chapter of High Quality Growth.
For more information, please refer to the JCET Fy2024 report
About the JCET group
JCET Group is the main provider of manufacturing and technology services of circuit of circuit integrated into the world. We offer a full range of turnkey solutions, including the design and characterization of the integration of semiconductor packages, R&D, the pitch survey, bumps, package assembly, end tests and deposit shipping to suppliers around the world.
Our complete portfolio extends over a wide range of semiconductor applications – including mobile, communication, IT, consumer, automobile and industry – delivered by advanced brochure, 2.5D / 3D packaging, system solutions in pack and Flip chip technologies and Filip riots.
JCET Group has two R&D centers in China and Korea; Eight manufacturing sites through ChinaKorea, and Singapore; And sales centers around the world, allowing close technological collaboration and effective manufacturing of the supply chain for our global customers.
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Source JCET Group
