HONG KONG SAR – Media OutReach – October 16, 2023 – With the support of the Office of Innovation, Technology and Industry and the Office for Attracting Strategic Enterprises (OASES), the Hong Kong Science and Technology Parks Corporation (HKSTP) signed a memorandum of understanding (MoU) with mainland China-based microelectronics company J2 Semiconductor (Shanghai) Co. Ltd.2 Semiconductor), to establish a global research and development (R&D) center focused on third-generation semiconductors at the Hong Kong Science Park, and to establish the first manufacturing facility for advanced 8-inch silicon carbide wafers (SiC) from Hong Kong.
This is a landmark moment in the government’s ambition to make Hong Kong one of the leading microelectronics hubs in the region. This further promotes new industrialization, a core element of the Office of Innovation, Technology and Industry which released its “Hong Kong Innovation and Technology Development Plan”, with the mission of developing strategically advanced manufacturing industries, such as microelectronics and semiconductors. As one of the world’s largest semiconductor import and export markets, Hong Kong lies at the heart of the Greater Bay Area, which offers enormous potential to become a key hub of the global semiconductor supply and value chain.
Professor Sun Dong, Secretary for Innovation, Technology and Industry, said: “This collaboration between HKSTP and J2 Semiconductor, the first large-scale semiconductor wafer manufacturing plant in Hong Kong, demonstrates the HKSAR government’s commitment to taking the lead in turning its vision of “new industrialization” into action. J.2 Semiconductor proactively strengthens the capacity, quality and competitiveness of Hong Kong’s technology talent pool. The project will also boost the development of related industries, including semiconductor equipment manufacturers, material suppliers and testing service providers, to develop a comprehensive ecosystem to strengthen Hong Kong’s position in the chain. value of the semiconductor industry.
The collaboration between HKSTP and J2 Semiconductor is jointly supported by the Office of Innovation, Technology and Industry and OASES to support Hong Kong’s innovation and technology ecosystem and promote new industrialization. The MoU was attended by Professor Sun Dong, Secretary of the Office of Innovation, Technology and Industry, Mr. Philip Yung, Director General of OASES, Ms. Lillian Cheong, Undersecretary for Innovation, Technology and Industry, Dr. Sunny Chai, President of HKSTP and Dr. Robert Tsu, President of J2 Semiconductor. While Mr. Albert Wong, CEO of HKSTP and Mr. TY Chu, Co-CEO of J2 Semiconductor has officially signed the MoU.
Dr Sunny Chai, President of HKSTP, said: “The plan to create J2 The Semiconductor R&D Center located in the Science Park will promote advanced R&D and manufacturing capabilities of third-generation semiconductor devices in Hong Kong. J.2 Semiconductor brings its core technology and expertise in advanced chip design, manufacturing process and semiconductor product development to Hong Kong, an important step in the development of the microelectronics industry in Hong Kong . As one of Hong Kong’s flagship innovation and technology platforms, we provide high-quality infrastructure and facilities as well as an extensive partner network, which will continue to promote Hong Kong’s microelectronics R&D capabilities Kong and strengthen Hong Kong’s position as an international I&T hub.
Dr Robert Tsu, President of J2 Semiconductor said: “I am very grateful for the level of attention and support from the Office of Innovation, Technology and Industry and the HKSTP towards this project. The signing of the MoU officially launches our third-generation 8-inch advanced SiC semiconductor wafer manufacturing project. J2 Semiconductor will invest approximately HK$6.9 billion in the project, intending to start volume production in the next two years and reach an annual production capacity of 240,000 SiC wafers in 2028 , generating an annual output value of more than 11 billion Hong Kong dollars. and create more than 700 jobs in Hong Kong. The project will contribute to the early completion of the localization of the new energy vehicle supply chain and drive the long-term development and prosperity of the semiconductor industry in Hong Kong.
As a semiconductor chip design company, J2 Semiconductor is committed to meeting the high demand for locally produced automotive chips from China’s automotive industry. It primarily provides high-performance silicon carbide (SiC) devices, with a focus on automotive, power conversion and communications. J.2 Semiconductor’s superior SiC technology can be applied to relevant applications such as electric vehicles, as well as associated infrastructure such as charging stations, smart grids and energy storage.
HKSTP is committed to promoting Hong Kong’s new industrialization mission and building a world-leading microelectronics ecosystem. HKSTP has established an extensive microelectronic hardware infrastructure network, including Sensor Packaging and Integration Lab (Sensor Lab), Heterogeneous Integration Lab (HI Lab) and Hardware Lab, which can support the end-to-end process of design, prototyping and piloting. production of equipment and systems as well as chip-related products. The Yuen Long Innovation Park Microelectronics Center is expected to begin operations in 2024, supporting HKSTP’s infrastructure to accelerate pilot production of microelectronics R&D, creating opportunities for businesses up and down the chain industrial.
HKSTP’s microelectronics ecosystem is thriving, with more than 200 microelectronics-related companies. The creation of the J2 Semiconductor facilities in Hong Kong will create a greater level of synergy and knowledge exchange. Currently, five Hong Kong universities are ranked among the world’s top 100 universities, with more than 100 academic researchers engaged in microelectronics research and promoting R&D of third-generation semiconductors. In this year’s budget speech, the HKSAR government announced plans to establish a microelectronics research and development institute to strengthen collaboration with universities, R&D centers and companies in the sector, and accelerate further “1 to N” translation of R&D results and strengthen the industry. development.
The issuer is solely responsible for the content of this announcement.