TAIPEI, TAIWAN – Media OutReach – October 12, 2023 – DFI, the global leader in embedded motherboards and industrial computers, recently sponsored the DHBW engineering team with its CMS103 motherboard and PCSF51 single-board computer in the international competition of design Formula Student Germany (FSG), where they achieved an impressive third place among over 100 competing teams and 3,000 students. DHBW Engineering used DFI’s ultra-thin, low-power SBCs, making them one of the few teams capable of delivering autonomous driving projects. As a result, the endurance performance of these components has become a critical factor in achieving higher scores.
Nearly 60 students make up the DHBW engineering team, which participated in two other competitions this year: FSN and FSA. Their performances faced challenges due to technical issues related to factors such as endurance. With the help of DFI products, DHBW Engineering overcame previous difficulties and achieved impressive results at this year’s FSG.
“We used DFI products in our autonomous system. DFI provided us with a vital part of the hardware on which the software architecture of the autonomous system runs, allowing us to be the only one of the top 6 ranked teams on FSG to successfully complete the two autonomous disciplines”, exclaimed Christian Stirm, head of autonomous systems at DHBW Engineering.
Even though DHBW had the capacity to carry out autonomous driving projects, its past performance in this FSG discipline did not meet expectations. With enhanced CPU and GPU performance, DFI’s CMS103 motherboard revolutionized the computing power of driverless racing car PCs for autonomous route calculations and effectively provided the necessary computing capacity for the autonomous system.
DFI’s SBC PCSF51 was selected for DHBW Engineering’s race car due to its lightweight design and fuel efficiency. The PCSF51 weighed only 150 grams and required only 20 watts to operate, remained reliable despite the heavy computing loads of the CANape program and also monitored battery temperature during competition to prevent any heat-related power reduction.
“We are honored to have the opportunity to help DHBW Engineering reach its full potential, as we believe it is crucial to encourage the current generation of engineers to develop skills for intelligent transformation and the future of the automotive industry,” said Jarry Chang. , General Manager of the DFI Product Center.
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